Current state-of-the-art computer based methodologies used in the design and analysis of thermomechanical systems will be presented and illustrated by selected laboratory demonstrations, and used in projects. Projects will include thermal, mechanical, electronic, and photonic loads of steady state and dynamic nature and will integrate design, analysis, and testing. Students will prepare a technical report and present their results. Topics will include, but not be limited to, thermomechanics of fiber optic telecommunication cables, high-energy beam interactions with materials, shape memory alloys, microelectronics, MEMS and mechatronics. This course will be offered in 2022-23, and in alternating years thereafter.
ME 4430: Integrated Thermomechanical Design and Analysis
Department
Category
Category II (offered at least every other Year)